Study on Reliability Enhancement Testing for InSb Focal Plane Array Detector

被引：0
|
作者：
Chao, Meng [1 ]
Jing, Peng [1 ]
Wei, Ma [1 ]
机构：
[1] Luoyang Optoelect Inst, Luoyang 471009, Henan, Peoples R China
来源：
INTERNATIONAL SYMPOSIUM ON PHOTOELECTRONIC DETECTION AND IMAGING 2011: ADVANCES IN INFRARED IMAGING AND APPLICATIONS | 2011年 / 8193卷
关键词：
Reliability enhancement testing; Focal plane array detector; Step-stress; InSb;
D O I：
10.1117/12.900272
中图分类号：
O43 [光学];
学科分类号：
070207 ; 0803 ;
摘要：
InSb focal plane array (FPA) detectors which are important components of infrared systems have great influence on systems' reliability and development. Few researches have been focused on this field in recent years. Therefore, it is rather essential to carry out reliability test. In the paper, reliability enhancement testing has been carried out on 128x128 elements InSb FPA detectors to discuss the influence of temperature stresses and vibration stresses on structure and performance. Working boundary conditions of InSb FPA detectors were obtained. Aiming at the failure the corresponding improvements were adopted, and reliability of detector was enhanced greatly.
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页数：7
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