An efficient transient three-dimensional thermomechanical modeling of dynamic thermal stress building and releasing in a selective laser melting process

The selective laser melting (SLM) process involves irradiation from a high-power laser to melt and sinter powdered material. The high temperature gradient near the laser spot generates high residual stress that can lead to failure of fabricated parts. Estimation of the residual stress for real transient SLM processes by simulation involves considerable computation effort which makes its application in real industrial SLM processes rather difficult. To tackle this challenge, a two-stage coupled transient thermomechanical model with a quasi-transient heat source was developed. In the first stage, a transient thermal analysis was performed to acquire temperature distribution of the full SLM process. The temperature distribution serves as thermal loading input for subsequent transient thermal stress analysis. This quasi-transient thermomechanical model can provide residual stress data consistent with that of a conventional full transient model in 68% less computation time. The data provided by the new model also includes the dynamic stress release due to re-heating and re-melting in overlapped laser scanned regions which was in close confirmation with experimental results. This efficient quasi-transient model is useful for rapid analysis and optimization of SLM processing parameters.