Solvent-induced surface instability of thin metal films on a polymer substrate

被引：7
|
作者：
Xue, Xiuli [1 ,2 ]
Wang, Shibin [1 ]
Zeng, Chaofeng [2 ]
Li, Linan [1 ]
Li, Chuanwei [1 ]
机构：
[1] Tianjin Univ, Sch Mech Engn, Dept Mech, Tianjin 300072, Peoples R China
[2] Hunan Univ Sci & Technol, Sch Civil Engn, Dept Engn Mech, Xiangtan 411201, Peoples R China
来源：
SURFACE AND INTERFACE ANALYSIS | 2018年 / 50卷 / 02期
基金：
中国国家自然科学基金;
关键词：
buckle; film stress; polymer substrate; solvent diffusion; thin film; TELEPHONE CORD BUCKLES; WRINKLING PATTERNS; SIALNX FILMS; DELAMINATION; COATINGS; GELS; NANOSTRUCTURES; IMPERFECTIONS; COMPRESSION; ADHESION;
D O I：
10.1002/sia.6356
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
The solvent-provoked formation and evolution of thin film buckling-delamination on a compliant substrate have been studied. The film surface is observed by an optical microscope showing a remarkable dynamic buckling-delamination development and a subsequent stable branched-straight state. It is revealed that the initiation, propagation, and the resulting patterns of film buckles are strongly dependent on the solvent type, film stress, interfacial adhesion, and film thickness. The buckling could be controlled further by a reasonable chemical solvent configuration and used to provide useful information for the pattern creation on polymer systems in diverse fields, such as micro/nanofabrication and optics.
引用
收藏
页码：180 / 187
页数：8
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