Thermal degradation of poly(methyl methacrylate) on SiO2 nanoparticles as a function of SiO2 size and silanol density

被引:31
作者
Madathingal, Rajesh Raman [1 ]
Wunder, Stephanie L. [1 ]
机构
[1] Temple Univ, Dept Chem, Philadelphia, PA 19122 USA
关键词
Interphase region; Interface; Confinement effects; Silanol density; Isolated silanols; Hydrogen bonding interactions; Glass transition; PMMA; SURFACE HYDROXYL-GROUPS; GLASS-TRANSITION; OXIDATIVE-DEGRADATION; PRECIPITATED SILICAS; CLAY NANOCOMPOSITES; POLYMER; FILMS; THERMOGRAVIMETRY; FLAMMABILITY; CALORIMETRY;
D O I
10.1016/j.tca.2011.08.026
中图分类号
O414.1 [热力学];
学科分类号
摘要
The degradation behavior of amorphous polymethyl methacrylate (PMMA) on silica (SiO2) nanoparticles (PMMA-SiO2) as a function of silanol density and nanoparticle size was investigated by derivative thermogravimetric analysis (dTGA). The thermal degradation temperature, T-d was measured for PMMA adsorption amounts below plateau adsorption, which enhanced the contribution of chains in direct contact with the silica. T-d increased as the number of hydrogen bonds between the silanol (SiOH) groups of the SiO2 and the carbonyl (C=O) of the PMMA increased, either from varying the heat treatment of the SiO2, which changed the silanol density, or increasing the nanoparticle size, thus increasing the number of sites where the PMMA chain contacted the nanoparticles. The increases in T-d correlated with increases in T-g for the PMMA-SiO2, suggesting that the enhanced thermal stability was attributable to decreased segmental mobility of PMMA chain segments, which in turn decreased thermally induced degradation. T-d and T-g did not change for polar PMMA on hydrophobically modified SiO2, (CH3)-SiO2, as expected based on this mechanism, since there were no specific hydrogen-bond interactions between the C=O of PMMA and the Si-O-(CH3)(3) of SiO2. (C) 2011 Elsevier B.V. All rights reserved.
引用
收藏
页码:83 / 89
页数:7
相关论文
共 50 条
[31]   One-step sol-gel preparation of hydrophobic antireflective SiO2 coating on poly(methyl methacrylate) substrate [J].
Huang, Xiaoxu ;
Yuan, Ye ;
Liu, Shaozhe ;
Wang, Wei ;
Hong, Ruijiang .
MATERIALS LETTERS, 2017, 208 :62-64
[32]   Influence of SiO2 nanoparticles on morphology, optical, and conductivity properties of Poly (ethylene oxide) [J].
Hameed, Talaat A. ;
Mohamed, F. ;
Abdelghany, A. M. ;
Turky, G. .
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 31 (13) :10422-10436
[33]   HfO2-assisted SiO2 reduction in HfO2/SiO2/Si stacks [J].
Li, Xiuyan ;
Yajima, Takeaki ;
Nishimura, Tomonori ;
Nagashio, Kosuke ;
Toriumi, Akira .
THIN SOLID FILMS, 2014, 557 :272-275
[34]   Application of SiO2 nanoparticles with double layer coverage consist of citric acid and l(+)-ascorbic acid for the production of poly(vinyl chloride)/SiO2 nanocomposite films with enhanced optical and thermal properties [J].
Mallakpour, Shadpour ;
Naghdi, Mina .
POLYMER BULLETIN, 2016, 73 (06) :1701-1717
[35]   Effect of the SiO2/Si interface on self-diffusion in SiO2 upon oxidation [J].
Uematsu, Masashi ;
Ibano, Kenzo ;
Itoh, Kohei M. .
DIFFUSION IN SOLIDS AND LIQUIDS III, 2008, 273-276 :685-692
[36]   The release of TiO2 and SiO2 nanoparticles from nanocomposites [J].
Reijnders, L. .
POLYMER DEGRADATION AND STABILITY, 2009, 94 (05) :873-876
[37]   Photoluminescence from Interface of SiO/SiO2 Superlattices [J].
Wang Shen-wei ;
Yi Li-xin ;
He Zhen ;
Hu Feng ;
Wang Yong-sheng .
SPECTROSCOPY AND SPECTRAL ANALYSIS, 2009, 29 (05) :1197-1200
[38]   Influence of selective distribution of SiO2 nanoparticles on shape memory behavior of co-continuous PLA/NR/SiO2 TPVs [J].
Liu, Yutong ;
Huang, Jiarong ;
Zhou, Jiadi ;
Wang, Yanpeng ;
Cao, Liming ;
Chen, Yukun .
MATERIALS CHEMISTRY AND PHYSICS, 2020, 242
[39]   Comparison of Dynamic Mechanical Properties and Thermal Conductivity of Unsaturated Polyester Composites Filled With Plain SiO2 Aerogel and Core-Shell SiO2 Aerogel [J].
Halim, Z. A. A. ;
Yajid, M. A. M. .
MATERIALS TODAY-PROCEEDINGS, 2019, 17 :686-693
[40]   In situ synthesis of PMIA/SiO2 nanocomposites and porous PMIA films via SiO2 etching: thermal, mechanical, and dielectric properties [J].
Abdelaty, M. ;
Zhu, Huanhuan ;
Ewais, Hassan A. ;
Morsy, Ahmed ;
Zhao, Yun ;
Jiao, Qingze .
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2025, 36 (16)