Electromigration effects upon the Sn/Ni-7 wt % V interfacial reactions

被引:10
作者
Chen, Chih-chi [1 ]
Chen, Sinn-wen [1 ]
Chang, Chih-horng [1 ]
机构
[1] Natl Tsing Hua Univ, Dept Chem Engn, Hsinchu 300, Taiwan
关键词
D O I
10.1063/1.2899956
中图分类号
O59 [应用物理学];
学科分类号
摘要
The electromigration effects upon the Sn/Ni - 7 wt % V interfacial reactions are examined. A ternary T phase was formed in the Sn/Ni - 7 wt % V couple reacted at 200 C in the early stage. The reaction phases became T/Ni(3)Sn(4) and an interesting T/Ni(3)Sn(4)/T/Ni(3)Sn(4) alternating layer structure with longer reaction time. The passage of electric current of 500 A/cm(2) density through the couple alters the reaction rates and the phase progression time. At the interface with electrons flow concurrently to the diffusion of Sn atoms, the reaction rates are enhanced. (c) 2008 American Institute of Physics.
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页数:4
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共 21 条
[1]   Electromigration effects in Al-Au multilayers [J].
Bertolino, N ;
Garay, J ;
Anselmi-Tamburini, U ;
Munir, ZA .
SCRIPTA MATERIALIA, 2001, 44 (05) :737-742
[2]   The Sn/Ni-7Wt.%V interfacial reactions [J].
Chen, Chih-Chi ;
Chen, Sinn-Wen .
JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (09) :1701-1707
[3]   Interfacial reactions in the Sn-(Ag)/(Ni,V) couples and phase equilibria of the Sn-Ni-V system at the Sn-Rich corner [J].
Chen, Chih-Chi ;
Chen, Sinn-Wen ;
Kao, Ching-Ya .
JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (05) :922-928
[4]   Electromigration effect upon the Sn/Ag and Sn/Ni interfacial reactions at various temperatures [J].
Chen, CM ;
Chen, SW .
ACTA MATERIALIA, 2002, 50 (09) :2461-2469
[5]   Electric current effects on Sn/Ag interfacial reactions [J].
Chen, CM ;
Chen, SW .
JOURNAL OF ELECTRONIC MATERIALS, 1999, 28 (07) :902-906
[6]   Electric current effects upon the Sn/Cu and Sn/Ni interfacial reactions [J].
Chen, SW ;
Chen, CM ;
Liu, WC .
JOURNAL OF ELECTRONIC MATERIALS, 1998, 27 (11) :1193-1198
[7]  
CHEN SW, 2006, SCRIPTA MATER, V56, P453
[8]   Effects upon interfacial reactions by electric currents of reversing directions [J].
Du, MY ;
Chen, CM ;
Chen, SW .
MATERIALS CHEMISTRY AND PHYSICS, 2003, 82 (03) :818-825
[9]   Pb-free solders for flip-chip interconnects [J].
Frear, DR ;
Jang, JW ;
Lin, JK ;
Zhang, C .
JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 2001, 53 (06) :28-+
[10]   Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples [J].
Gan, H ;
Tu, KN .
JOURNAL OF APPLIED PHYSICS, 2005, 97 (06)