Deformation behavior and microstructure of Ti6Al4V manufactured by SLM

被引:123
作者
Krakhmalev, P. [1 ]
Fredriksson, G. [1 ]
Yadroitsava, I. [2 ]
Kazantseva, N. [3 ]
du Plessis, A. [4 ]
Yadroitsev, I. [2 ]
机构
[1] Karlstad Univ, Dept Engn & Phys, SE-65188 Karlstad, Sweden
[2] Cent Univ Technol, Dept Mech & Mechatron Engn, Private Bag X20539, ZA-9300 Bloemfontein, South Africa
[3] Urals Branch Acad Sci, Inst Met Phys, Ekaterinburg 620219, Russia
[4] Univ Stellenbosch, CT Scanner Facil, Private Bag 11, ZA-7602 Stellenbosch, South Africa
来源
LASER ASSISTED NET SHAPE ENGINEERING 9 INTERNATIONAL CONFERENCE ON PHOTONIC TECHNOLOGIES PROCEEDINGS OF THE LANE 2016 | 2016年 / 83卷
关键词
Ti6Al4V; tensile test; mechanical properties; porosity; microstructure; twinning; X-RAY TOMOGRAPHY; MECHANICAL-PROPERTIES; TITANIUM-ALLOYS; TI-6AL-4V; DUCTILITY; POROSITY; IMPROVEMENT;
D O I
10.1016/j.phpro.2016.08.080
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Mechanical properties, porosity, and microstructure of Ti6Al4V (ELI) material produced by Selective Laser Melting (SLM) under controlled oxygen content were analyzed. Fully martensitic alpha structure with high dislocation density and stacking faults was observed in both as-built and stress relieved samples by means of XRD and TEM. Tensile {101 (2) over bar} twinning was identified by TEM and electron diffraction. Accommodation of thermal stresses during manufacturing was suggested as a possible reason for twinning. Computed tomography of pores was carried out. Pores in the specimens were evenly distributed and mostly had an elongated shape. Defect analysis by micro CT scans in pre-strained samples confirmed that the pore coalescence was the main crack formation mechanism in the final fracture with typical cup-and-cone fracture morphology. Additionally, typical dimples and quasi-cleavage were revealed. Mechanical properties of the samples after stress relieving heat treatment at 650 degrees C for 3 h are complied with the international standard for Ti alloys for biomedical applications. (C) 2016 The Authors. Published by Elsevier B.V.
引用
收藏
页码:778 / 788
页数:11
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