Introduction to the Special Issue on the 2018 IEEE International Solid-State Circuits Conference (ISSCC)

被引：0
|
作者：
Xu, Yong-Ping [1 ]
Kuo, Tai-Haur [2 ]
Straayer, Matt [3 ]
Krishnaswamy, Harish [4 ]
Natarajan, Arun [5 ]
机构：
[1] Natl Univ Singapore, Dept Elect & Comp Engn, Singapore, Singapore
[2] Natl Cheng Kung Univ, Mixed Signal Integrated Circuit Lab, Tainan, Taiwan
[3] Maxim Integrated, Adv R&D, North Chelmsford, MA 01863 USA
[4] Columbia Univ, Dept Elect Engn, New York, NY 10027 USA
[5] Oregon State Univ, Sch Elect Engineeering & Comp Sci, Corvallis, OR 97330 USA
来源：
IEEE JOURNAL OF SOLID-STATE CIRCUITS | 2018年 / 53卷 / 12期
基金：
美国国家科学基金会;
关键词：
D O I：
10.1109/JSSC.2018.2880171
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This Special Issue of the IEEE Journal of Solid-State Circuits is dedicated to a set of the best papers selected from the 2018 IEEE International Solid-State Circuits Conference (ISSCC) that took place February 11-15, 2018, in San Francisco, CA, USA. This issue covers papers from the Analog, Power Management, Data Converters, RF, and Wireless committees. © 1966-2012 IEEE.
引用
收藏
页码：3343 / 3346
页数：4
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