Advanced monolithic active pixel sensors for tracking, vertexing and calorimetry with full CMOS capability

We present test results from the "TPAC" and "FORTIS" sensors produced using the 180 nm CMOS INMAPS process. The TPAC sensor has a 50 mu m pixel size with advanced in-pixel electronics. Although TPAC was developed for digital electromagnetic calorimetry, the technology can be readily extended to tracking and vertexing applications where highly granular pixels with in-pixel intelligence are required. By way of example, a variant of the TPAC sensor has been proposed for the SuperB vertex detector. The FORTIS sensor is a prototype with several pixel variants to study the performance of a four transistors (4T) architecture and is the first sensor of this type tested for particle physics applications. TPAC and FORTIS sensors have been fabricated with some of the processing innovations available in INMAPS such as deep p-wells and high-resistivity epitaxial layers. The performance of these sensor variants has been measured both in the laboratory and at test beams and results showing significant improvements due to these innovations are presented. We have recently manufactured the "CHERWELL" sensor, building on the experience with both TPAC and FORTIS and making use of the 4T approach. CHERWELL is designed for tracking and vertexing and has an integrated ADC and targets very low-noise performance. The principal features of CHERWELL are described. Crown Copyright (C) 2010 Published by Elsevier B.V. All rights reserved.