共 19 条
[6]
Friedman H.L., 2007, J POLYM SCI C, V6, P183, DOI [DOI 10.1002/POLC.5070060121, 10.1002/polc.5070060121]
[9]
A pyrolysis-based technology for recovering useful materials from IC package molding resin waste
[J].
PROCEEDINGS OF THE 1996 IEEE INTERNATIONAL SYMPOSIUM ON ELECTRONICS AND THE ENVIRONMENT, CONFERENCE RECORD,
1996,
:124-129