Investigation of Copper Plating and Additive Interactions in the Presence of Fe3+/Fe2+ Redox Couple

被引：14

作者：

Volov, Igor ^{[1
]}

Saito, Tadashi ^{[2
]}

West, Alan C. ^{[1
]}

机构：

[1] Columbia Univ, Dept Chem Engn, New York, NY 10027 USA

[2] Atotech Japan KK, Midori Ku, Kanagawa 2260006, Japan

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 2011年 / 158卷 / 06期

关键词：

POLYETHYLENE-GLYCOL; TRIBLOCK COPOLYMER; BUMP FORMATION; CHLORIDE-ION; L-CYSTEINE; ELECTRODEPOSITION; PEG; SPS; DEPOSITION; ACID;

D O I：

10.1149/1.3575638

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The impact of the ferric/ferrous (Fe3+/Fe2+) redox couple on the behavior of polyethylene glycol (PEG) and bis-(3-sulfopropyl) disulfide (SPS) during copper electrodeposition is investigated. The Fe3+/Fe2+ couple is used in plating of copper onto printed circuit boards and may have advantages when implemented for on-chip metallization of copper. Experiments show that in the presence of Fe3+/Fe2+ the suppressing behavior of PEG does not change; in contrast, the accelerating activity of SPS increases when Fe3+/Fe2+ is present in a copper-plating bath. Furthermore, potentiostatic experiments suggest that SPS interacts with Fe2+ ions in the bulk electrolyte, probably to produce 3-mercapto-1-propane sulfonic acid (MPS) at low ppb levels. (C) 2011 The Electrochemical Society. [DOI: 10.1149/1.3575638] All rights reserved.

引用

页码：D384 / D389

页数：6

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