Ag content effect on mechanical properties of Sn-xAg-0.5Cu solders

被引：28

作者：

Che, F. X. ^{[1
]}

Poh, Edith Candy ^{[1
]}

Zhu, W. H. ^{[1
]}

Xiong, B. S. ^{[1
]}

机构：

[1] UTAC, Singapore 554916, Singapore

来源：

2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2 | 2007年

关键词：

D O I：

10.1109/EPTC.2007.4469808

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

In this work, the Ag content effect on material properties of Sn-xAg-0.5Cu solders was investigated based on tensile test for bulk solder. In this study, three different Ag contents including 1%, 2% and 3% Ag in Sn-xAg-0.5Cu solder were investigated. The material properties, such as elastic modulus, UTS (Ultimate Tensile Strength) and yield stress were evaluated for different Ag content bulk solder. In addition, the strain rate effect on material properties of Sn-xAg-0.5Cu solder was also investigated considering 5 different strain rates from 10(-5) to 10(-1). Results show that the elastic modulus, yield stress and UTS of Sn-xAg-0.5Cu solder increase with Ag content. The relationships of strain rate, Ag content and material properties were developed and material constants in curve fitting equations were presented.

引用

页码：713 / 718

页数：6

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