Effect of Bismuth Addition on Physical Properties of Sn-Zn Lead-Free Solder Alloy

被引：17
作者：
Al-Ezzi, Athil [1 ]
Al-Bawee, Abbas [1 ]
Dawood, Feryal [2 ]
Shehab, Abeer A. [1 ]
机构：
[1] Univ Diyala, Dept Mat Engn, Diyala 32001, Iraq
[2] Univ Diyala, Sci Dept, Diyala 32001, Iraq
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2019年 / 48卷 / 12期
关键词：
Sn-9Zn; lead-free solder; melting point; pasty range; contact angle; electrical resistivity; TENSILE PROPERTIES; MICROSTRUCTURE;
D O I：
10.1007/s11664-019-07577-w
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The aim of this work is to improve the properties of eutectic Sn-9Zn solder alloy by adding different amounts of bismuth to produce alternate lead-free solder alloys for use in electronic applications. Phase identification of the various solders was performed by x-ray diffraction analysis. Scanning electron microscopy was employed for morphological characterization of the prepared solder alloys. Spreading tests were used to measure the contact angle, and the electrical resistance was measured. Differential scanning calorimetry (DSC) thermographs were obtained for the alternate lead-free alloys. The results showed that Bi addition could clearly improve the wettability and physical properties of the Sn-9Zn base alloy by decreasing the melting point.
引用
收藏
页码：8089 / 8095
页数：7
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