Review and analysis of SiC MOSFETs' ruggedness and reliability

被引:125
作者
Wang, Jun [1 ]
Jiang, Xi [1 ]
机构
[1] Hunan Univ, Coll Elect & Informat Engn, Changsha, Peoples R China
关键词
wide band gap semiconductors; semiconductor device reliability; MOSFET; failure analysis; silicon carbide metal-oxide semiconductor field-effect transistors; power conversion applications; safety-critical applications; degradation mechanism; short-circuit ruggedness; avalanche ruggedness; reliability issues; gate oxide reliability; silicon insulated gate bipolar transistors; silicon carbide MOSFET ruggedness analysis; mitigation methods; failure mechanism; high-temperature bias stress; repetitive SC stress; avalanche stress; power cycling stress; body diode surge current stress; SiC; THRESHOLD-VOLTAGE INSTABILITY; GATE OXIDE; THERMAL OXIDES; 4H-SIC MOSFETS; FAILURE MODES; POWER; ROBUSTNESS; DEGRADATION; IMPROVEMENT; MECHANISMS;
D O I
10.1049/iet-pel.2019.0587
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
SiC MOSFETs (silicon carbide metal-oxide semiconductor field-effect transistors) are replacing Si insulated gate bipolar transistors in many power conversion applications due to their superior performance. However, ruggedness and reliability of SiC MOSFETs are still big concern for their widespread applications in the market, especially in safety-critical applications. The objective of this study is to provide a comprehensive picture on the ruggedness and reliability of commercial SiC MOSFETs, discover their failure or degradation mechanism, and propose some possible mitigation methods through both literature survey and in-depth analysis. The ruggedness of SiC MOSFETs discussed here includes short-circuit (SC) ruggedness, avalanche ruggedness, and their failure mechanism. The reliability issues include gate oxide reliability, degradation under high-temperature bias stress, repetitive SC stress, avalanche stress, power cycling stress, body diode's surge current stress, and their degradation mechanism. Furthermore, this study discusses methods and solutions to improve their ruggedness and reliability.
引用
收藏
页码:445 / 455
页数:11
相关论文
共 88 条
[51]   Insulator investigation on SiC for improved reliability [J].
Lipkin, LA ;
Palmour, JW .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1999, 46 (03) :525-532
[52]   Repetitive Unclamped-Inductive-Switching-Induced Electrical Parameters Degradations and Simulation Optimizations for 4H-SiC MOSFETs [J].
Liu, Siyang ;
Gu, Chunde ;
Wei, Jiaxing ;
Qian, Qinsong ;
Sun, Weifeng ;
Huang, Alex Q. .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2016, 63 (11) :4331-4338
[53]  
Luo H., 2018, CIPS 2018
[54]  
10th International Conference on Integrated Power Electronics Systems, P1
[55]   Role of Threshold Voltage Shift in Highly Accelerated Power Cycling Tests for SiC MOSFET Modules [J].
Luo, Haoze ;
Iannuzzo, Francesco ;
Turnaturi, Marcello .
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2020, 8 (02) :1657-1667
[56]  
Luo HZ, 2017, IEEE IND ELEC, P1525, DOI 10.1109/IECON.2017.8216259
[57]  
Luo HZ, 2017, IEEE ENER CONV, P2506, DOI 10.1109/ECCE.2017.8096478
[58]   Reliability and reliability investigation of wide-bandgap power devices [J].
Lutz, Josef ;
Franke, Joerg .
MICROELECTRONICS RELIABILITY, 2018, 88-90 :550-556
[59]   Time-dependent dielectric breakdown of thermal oxides on 4H-SiC [J].
Matocha, Kevin ;
Beaupre, Richard .
SILICON CARBIDE AND RELATED MATERIALS 2006, 2007, 556-557 :675-+
[60]   SiC power MOSFETs: Designing for reliability in wide-bandgap semiconductors [J].
Matocha, Kevin ;
Ji, In-Hwan ;
Zhang, Xuning ;
Chowdhury, Sauvik .
2019 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2019,