Instrumental difference including characteristic aspects between ESDA and JEDEC standards on CDM test have been investigated and discussed. ESDA test systems provides higher discharge current, lower rise time and lower full width at half maximum at the same stress level, which is due to the higher inductance in the discharge path. We have succeeded in finding out the linear relation of the stress condition between these 2 standards. Furthermore, the current monotonically increases with the stress level for all capacitances and depends on the package size as expected. The relationship between current and package area is proportional because a larger package affords a higher capacitance. The current tends to saturate with a package size over 250 mm(2) in both standards. The electrical failure yield of each standard system can be predicted by a stress condition of the other. The stress condition in JEDEC standard is undoubtedly a subset of the ESDA standard.
