Spin-dependent trap-assisted tunneling current in ultra-thin gate dielectrics

被引:8
|
作者
Miura, Y [1 ]
Fujieda, S [1 ]
机构
[1] NEC Corp Ltd, Syst Devices & Fundamental Res, Silicon Syst Res Labs, Tsukuba, Ibaraki 3058501, Japan
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 2001年 / 40卷 / 4B期
关键词
gate dielectrics; leakage current; silicon nitride; trap-assisted current; electron spin resonance; spin-dependent tunneling;
D O I
10.1143/JJAP.40.2840
中图分类号
O59 [应用物理学];
学科分类号
摘要
We have characterized the leak-age current paths of ultra-thin gate dielectrics using spin-dependent tunneling (SDT) spectroscopy. A spin-dependent current was detected in metal-oxide-semiconductor diodes with chemical-vapor-deposition SiN gate films with thickness less than 3 run. We examined the nature of the trap sites in terms of g-value, bias-dependent signal intensity, and magnetic-field orientation dependence. The main feature of the observed spectrum is attributed to a paramagnetic Si site in the SiN films. By using a quantitative model of electron spin-polarization, we were able to estimate the ratio of trap-assisted current to the total leak-age current.
引用
收藏
页码:2840 / 2843
页数:4
相关论文
共 12 条
  • [1] Advantage of the structure and the electrical properties of epitaxial ultra-thin zirconia gate dielectrics
    Kiguchi, Takanori
    Wakiya, Naoki
    Tanaka, Junzo
    Shinozaki, Kazuo
    MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS, 2008, 148 (1-3): : 30 - 34
  • [2] On the Temperature and Field Dependence of Trap-Assisted Tunneling Current in Ge p+n Junctions
    Simoen, Eddy
    De Stefano, Francesca
    Eneman, Geert
    De Jaeger, Brice
    Claeys, Cor
    Crupi, Felice
    IEEE ELECTRON DEVICE LETTERS, 2009, 30 (05) : 562 - 564
  • [3] ENERGY RESOLVED SPIN DEPENDENT TRAP ASSISTED TUNNELING INVESTIGATION OF SILC RELATED DEFECTS
    Ryan, J. T.
    Lenahan, P. M.
    Krishnan, A. T.
    Krishnan, S.
    2010 INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, 2010, : 1122 - 1125
  • [4] Novel fabrication process to realize ultra-thin (EOT=0.7nm) and ultra-low leakage SiON gate dielectrics
    Matsushita, D
    Muraoka, K
    Nakasaki, Y
    Kato, K
    Inumiya, S
    Eguchi, K
    Takayanagi, M
    2004 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS, 2004, : 172 - 173
  • [5] INTEGRATION OF PLASMA-ASSISTED AND RAPID THERMAL-PROCESSING FOR LOW-THERMAL BUDGET PREPARATION OF ULTRA-THIN DIELECTRICS FOR STACKED-GATE DEVICE STRUCTURES
    LUCOVSKY, G
    MA, Y
    HATTANGADY, SV
    LEE, DR
    LU, Z
    MISRA, V
    WORTMAN, JJ
    JING, Z
    WHITTEN, JL
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1994, 33 (12B): : 7061 - 7070
  • [6] Effect of chemical oxides formed during pre-gate oxide cleaning on the properties of sub 20 thick ultra-thin stack gate dielectrics
    Jeon, JS
    Ogle, B
    ULTRA CLEAN PROCESSING OF SILICON SURFACES 2000, 2001, 76-77 : 165 - 168
  • [7] Evolution of the Physics and Stochastics of Failure in Ultra-Thin Dielectrics - From SiO2 to Advanced High-K Gate Stacks
    Raghavan, Nagarajan
    2018 IEEE 8TH INTERNATIONAL NANOELECTRONICS CONFERENCES (INEC), 2018, : 15 - 16
  • [8] Photon-Assisted Spin-Dependent Tunneling in a Magnetic-Field Tunable Diluted Magnetic Semiconductor Structure with a Nonmagnetic Barrier
    Li, Chun-Lei
    Xu, Yan
    Guo, Yong
    SPIN, 2018, 8 (01)
  • [9] Effect of cluster structure on the transition from spin-dependent tunneling to percolation mechanism of conductivity in LaSr(Ca)MnO thin films
    Okunev, VD
    Samoilenko, ZA
    Pafomov, NN
    Plehov, AL
    Szymczak, R
    Baran, M
    Szymczak, H
    Lewandowski, SJ
    Gierlowski, P
    Abal'oshev, A
    PHYSICS LETTERS A, 2004, 332 (3-4) : 275 - 285
  • [10] Attoampere Level Leakage Current in Chemical Vapor Deposition-Grown Monolayer MoS2 Dynamic Random-Access Memory in Trap-Assisted Tunneling Limit
    Seok, Jisoo
    Seo, Jae Eun
    Lee, Dae Kyu
    Kwak, Joon Young
    Chang, Jiwon
    ACS NANO, 2025, 19 (02) : 2458 - 2467