Thermal expansion of Ti-Al-N and Cr-Al-N coatings

被引:48
作者
Bartosik, M. [1 ,2 ]
Holec, D. [2 ,3 ]
Apel, D. [4 ]
Klaus, M. [4 ]
Genzel, C. [4 ]
Keckes, J. [5 ]
Arndt, M. [6 ]
Polcik, P. [7 ]
Koller, C. M. [1 ,2 ]
Mayrhofer, P. H. [1 ,2 ]
机构
[1] TU Wien, Inst Mat Sci & Technol, A-1060 Vienna, Austria
[2] TU Wien, Christian Doppler Lab Applicat Oriented Coating D, A-1060 Vienna, Austria
[3] Univ Leoben, Dept Phys Met & Mat Testing, A-8700 Leoben, Austria
[4] Helmholtz Zentrum Berlin Mat & Energien, D-12489 Berlin, Germany
[5] Univ Leoben, Dept Mat Phys, A-8700 Leoben, Austria
[6] Oerlikon Surface Solut AG, Oerlikon Balzers, LI-9496 Balzers, Liechtenstein
[7] Plansee Composite Mat GmbH, D-86983 Lechbruck, Germany
基金
奥地利科学基金会;
关键词
Thermal expansion; TiN; CrN; Ti-Al-N; Cr-Al-N; AIN; Ab initio; RESIDUAL-STRESS; STABILITY; ZR;
D O I
10.1016/j.scriptamat.2016.09.022
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The thermal expansion coefficients (TECs) of B1 structured Ti-1-xAlxN and Cr-1-xAlxN thin films - investigated by synchrotron X-ray diffraction from room temperature to 600 degrees C - excellently agree with ab initio obtained temperature dependent calculations only if they were annealed at 600 degrees C. As-deposited thin films, with their built-in structural defects show a lower temperature dependence of their TECs and higher values. Furthermore, our data clearly show that the TECs of cubic Ti-1-xAlxN and Cr-1-xAlxN increase with increasing Al content, and that the TEC of wurtzite type B4 structured AlN is only about half of that of B1 AlN. (C) 2016 Acta Materialia Inc. Published by Elsevier Ltd. This is an open access article under the CC BY license.
引用
收藏
页码:182 / 185
页数:4
相关论文
共 29 条
  • [1] LATTICE-PARAMETERS AND THERMAL-EXPANSION OF TI(CXN1-X), ZR(CXN1-X), HF(CXN1-X) AND TIN1-X FROM 298-K TO 1473-K AS INVESTIGATED BY HIGH-TEMPERATURE X-RAY-DIFFRACTION
    AIGNER, K
    LENGAUER, W
    RAFAJA, D
    ETTMAYER, P
    [J]. JOURNAL OF ALLOYS AND COMPOUNDS, 1994, 215 (1-2) : 121 - 126
  • [2] [Anonymous], MAT SCI ENG A
  • [3] [Anonymous], THESIS
  • [4] Rietveld-based energy-dispersive residual stress evaluation: analysis of complex stress fields σij(z)
    Apel, Daniel
    Klaus, Manuela
    Genzel, Martin
    Genzel, Christoph
    [J]. JOURNAL OF APPLIED CRYSTALLOGRAPHY, 2014, 47 : 511 - 526
  • [5] Rietveld refinement of energy-dispersive synchrotron measurements
    Apel, Daniel
    Klaus, Manuela
    Genzel, Christoph
    Balzar, Davor
    [J]. ZEITSCHRIFT FUR KRISTALLOGRAPHIE-CRYSTALLINE MATERIALS, 2011, 226 (12): : 934 - 943
  • [6] Thermal expansion of rock-salt cubic AlN
    Bartosik, M.
    Todt, M.
    Holec, D.
    Todt, J.
    Zhou, L.
    Riedl, H.
    Boehm, H. J.
    Rammerstorfer, F. G.
    Mayrhofer, P. H.
    [J]. APPLIED PHYSICS LETTERS, 2015, 107 (07)
  • [7] Lateral gradients of phases, residual stress and hardness in a laser heated Ti0.52Al0.48N coating on hard metal
    Bartosik, M.
    Daniel, R.
    Zhang, Z.
    Deluca, M.
    Ecker, W.
    Stefenelli, M.
    Klaus, M.
    Genzel, C.
    Mitterer, C.
    Keckes, J.
    [J]. SURFACE & COATINGS TECHNOLOGY, 2012, 206 (22) : 4502 - 4510
  • [8] Tools with built-in thin film thermocouple sensors for monitoring cutting temperature
    Basti, Ali
    Obikawa, Toshiyuki
    Shinozuka, Jun
    [J]. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2007, 47 (05) : 793 - 798
  • [9] Influence of Zr on structure, mechanical and thermal properties of Ti-Al-N
    Chen, Li
    Holec, David
    Du, Yong
    Mayrhofer, Paul H.
    [J]. THIN SOLID FILMS, 2011, 519 (16) : 5503 - 5510
  • [10] Size effect of thermal expansion and thermal/intrinsic stresses in nanostructured thin films: Experiment and model
    Daniel, R.
    Holec, D.
    Bartosik, M.
    Keckes, J.
    Mitterer, C.
    [J]. ACTA MATERIALIA, 2011, 59 (17) : 6631 - 6645