LTCC in microsystems application

被引：0
作者：
Golonka, LJ [1 ]
Dziedzic, A [1 ]
Kita, J [1 ]
Zawada, T [1 ]
机构：
[1] Wroclaw Univ Technol, Fac Microsyst Elect & Photon, PL-50370 Wroclaw, Poland
来源：
INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS | 2002年 / 32卷 / 04期
关键词：
LTCC technology; MCM package; microsystems; sensors; activators;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Low Temperature Cofired Ceramic (LTCC) technology is used for many years as Multichip Module package. Recently LTCC found very wide area of application in microsystems thanks to very good electrical and mechanical properties, high reliability and stability as well as possibility of making three dimensional (3D) microstructures. The paper describes the new LTCC techniques developed for making microsystems. A short overview of various LTCC sensors, actuators, heating and cooling devices is given. The newest application of LTCC technology (fuel cell, microreactors, photonics and MOEMS packaging) are shortly described.
引用
收藏
页码：272 / 279
页数：8
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