The Effects of Thermal Loading on the Mechanical Properties of Interfaces of Dissimilar Materials by Nanoindentation Simulations

被引：0

作者：

Liao, Ningbo ^{[1
]}

Yang, Ping ^{[2
]}

Zhang, Miao ^{[1
]}

Xue, Wei ^{[1
]}

机构：

[1] Wenzhou Univ, Coll Mech & Elect Engn, Wenzhou 325035, Peoples R China

[2] Jiangsu Univ, Res Ctr Micronano Sci & Technol, Zhenjiang 212013, Peoples R China

来源：

JOURNAL OF ELECTRONIC PACKAGING | 2011年 / 133卷 / 02期

基金：

中国国家自然科学基金;

关键词：

modeling; interface; thermomechanical properties; debonding; nanoindentation test; NONEQUILIBRIUM; TEMPERATURE;

D O I：

10.1115/1.4003513

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Heat transfer across the interfaces of dissimilar materials is a critical consideration in a wide variety of scientific and engineering applications. In this paper, molecular dynamics (MD) simulations are conducted to investigate the effects of thermal loading on mechanical properties of Al-Cu and Cr-Cu interfaces. The mechanical properties are investigated by MD simulations of nanoindentation. Both the results of MD simulations and experiments show the Young's modulus decrease after thermal cycling, and the Cr-Cu interface is more sensitive to the thermal loading than the Al-Cu interface. The thermal loading and mechanical test models proposed here can be used to evaluate interfacial properties under the effects of heat transferring. [DOI: 10.1115/1.4003513]

引用

页数：4

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