Surface roughness of molecular resist for EUV lithography

被引:7
作者
Toriumi, Minoru [1 ]
Kaneyama, Koji [1 ]
Kobayashi, Shinji [1 ]
Itani, Toshiro [1 ]
机构
[1] Semicond Leading Edge Technol Inc, Lab Interdisciplinary Sci & Technol, Onogawa 16-1, Tsukuba, Ibaraki 3058569, Japan
来源
ADVANCES IN RESIST MATERIALS AND PROCESSING TECHNOLOGY XXV, PTS 1 AND 2 | 2008年 / 6923卷
关键词
surface roughness; LER; resist; molecular resist; AFM; EUV lithography;
D O I
10.1117/12.772349
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Surface roughness of molecular and polymer resists were probed with an atomic force microscope (AFM) and analyzed using the power spectrum density (PSD) function. The PSD curve obtained from AFM image of the molecular resist showed a broad profile dependent on the exposure dose and small roughness. The PSD increased more in the low spatial frequency range after the exposure and the correlation length was increased. Meanwhile, the PSD of the polymer resist showed a narrow profile with respect to the dose and large roughness. Overall increase in PSD with respect to the spatial frequency was observed after the exposure.
引用
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页数:8
相关论文
共 18 条
[1]  
BIAFORE J, 2007, P SPIE, V6519, P97001
[2]   Characterization and simulation of surface and line-edge roughness in photoresists [J].
Constandoudis, V ;
Gogolides, E ;
Patsis, GP ;
Tserepi, A ;
Valamontes, ES .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2001, 19 (06) :2694-2698
[3]   Effect of polymer molecular weight on AFM polymer aggregate size and LER of EUV resists [J].
Cutler, CA ;
Mackevich, JF ;
Li, JM ;
O'Connell, DJ ;
Cardinale, G ;
Brainard, RL .
EMERGING LITHOGRAPHIC TECHNOLOGIES VII, PTS 1 AND 2, 2003, 5037 :406-417
[4]  
FEDYNYSHYN TH, 2007, P SPIE, V6519
[5]   Extreme ultraviolet and X-ray resist: Comparison study [J].
He, D ;
Solak, H ;
Li, W ;
Cerrina, F .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1999, 17 (06) :3379-3383
[6]   Process dependence of roughness in a positive-tone chemically amplified resist [J].
He, D ;
Cerrina, F .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1998, 16 (06) :3748-3751
[7]   Effect of process parameters on pattern edge roughness of chemically-amplified resists [J].
Koh, HP ;
Lin, QY ;
Hu, X ;
Chan, L .
ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XVII, PTS 1 AND 2, 2000, 3999 :240-251
[8]   Pixelated chemically amplified resists: Investigation of material structure on the spatial distribution of photoacids and line edge roughness [J].
La, Young-Hye ;
Park, Sang-Min ;
Meagley, Robert P. ;
Leolukman, Melvina ;
Gopalan, Padma ;
Nealey, Paul F. .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2007, 25 (06) :2508-2513
[9]   Toward controlled resist line edge roughness: Material origin of line edge roughness in chemically amplified positive-tone resists [J].
Lin, QH ;
Sooriyakumaran, R ;
Huang, WS .
ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XVII, PTS 1 AND 2, 2000, 3999 :230-239
[10]  
MA Y, 2007, P SPIE, V6518