共 8 条
- [1] [Anonymous], 2006, INT TECHNOLOGY ROADM
- [2] OPERATIONAL CHARACTERISTICS OF SF6 ETCHING IN AN ELECTRON-CYCLOTRON RESONANCE PLASMA REACTOR [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1991, 9 (02): : 318 - 324
- [3] Jolliffe I. T., 1986, PRINCIPAL COMPONENT, DOI DOI 10.1016/0169-7439(87)80084-9
- [4] Heterogeneous recombination of atomic bromine and fluorine [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1999, 17 (01): : 282 - 290
- [5] The recombination of chlorine atoms at surfaces [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1998, 16 (01): : 270 - 277
- [6] TANAKA J, 2003, APC AEC S P 15 SESS, V7
- [7] Relation between the ion flux, gas phase composition, and wall conditions in chlorine plasma etching of silicon [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2003, 21 (03): : 589 - 595
- [8] Effect of surface polymerization on plasma and process stability in polycrystalline-silicon etching [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 2002, 20 (06): : 2123 - 2130