The Effect of Organic Surface-Active Additives Upon the Kinetics of Electrodeposition of Ultrafine Copper Powder

被引：5
作者：
Demeev, Baurzhan B. [1 ]
Dauletbay, Akbar [1 ]
Nauryzbaiev, Micael K. [1 ]
机构：
[1] Al Farabi KazNU, Ctr Physicochem Methods Res & Anal, Alma Ata, Kazakhstan
来源：
INTERNATIONAL CONFERENCE ON NANOTECHNOLOGY BASED INNOVATIVE APPLICATIONS FOR THE ENVIRONMENT | 2016年 / 47卷
关键词：
NUCLEI;
D O I：
10.3303/CET1647036
中图分类号：
X [环境科学、安全科学];
学科分类号：
08 ; 0830 ;
摘要：
The influence of organic additives on the kinetics of electrodeposition of copper ions on the surface of the polycrystalline copper electrode from the mixed aqueous-organic solutions, the possibility of obtaining ultrafine powders of copper by electrolysis in a water-isopropanol solution of cupric nitrate in the presence of additives, polyvinyl alcohol and cationic amine containing polyelectrolyte VPK, are investigated in this work. It is shown that the organic surfactants can reduce the particle size of the copper powder and increase the homogeneity with respect to fractional composition.
引用
收藏
页码：211 / 216
页数：6
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