Intermetallic phase formation in electrochemical alloy deposition

被引：19

作者：

Fujiwara, Y ^{[1
]}

Enomoto, H ^{[1
]}

机构：

[1] Osaka Municipal Tech Res Inst, Joto Ku, Osaka 5368553, Japan

来源：

JOURNAL OF SOLID STATE ELECTROCHEMISTRY | 2004年 / 8卷 / 03期

关键词：

electrochemical deposition; intermetallic phases; site exchange; solid-state diffusion; underpotential deposition;

D O I：

10.1007/s10008-003-0441-5

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

Three examples of the electrochemical deposition of intermetallic phases are shown. Electrodeposition of the single-phase beta'-brass superlattice at underpotentials of Zn in Cu-Zn alloy plating is explained by an accumulative underpotential deposition (UPD) mechanism. Growth of the Cu-Sn intermetallic phase layer in the contact immersion deposition of Sn onto Cu is accounted for by a UPD/vertical solid-state diffusion mechanism. Ag3Sn formation in the Sn/Ag-nanoparticle composite plating is illustrated by atomic site exchange at the interface between the deposited Sn matrix and the occluded Ag nanoparticles.

引用

页码：167 / 173

页数：7

共 33 条

[1]

Anderko K., 1958, CONSTITUTION BINARY, P649

[2] KINETICS OF TRANSFORMATION OF METASTABLE TIN-NICKEL DEPOSITS .2. FORMATION AND TRANSFORMATION MECHANISMS [J].

AUGIS, JA ;

BENNETT, JE .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1978, 125 (02) :335-339

[3] UNDERPOTENTIAL ALLOY FORMATION IN THE SYSTEM AG(HKL)/CD2+ [J].

BORT, H ;

JUTTNER, K ;

LORENZ, WJ ;

STAIKOV, G .

ELECTROCHIMICA ACTA, 1983, 28 (07) :993-1001

[4]

BRENNER A, 1963, ELECTRODEPOSITION AL, V1, P411

[5]

Brenner A., 1963, ELECTRODEPOSITION AL

[6]

Budevski E., 1996, ELECTROCHEMICAL PHAS, P128

[7]

Cullity BD, 1978, ELEMENTS XRAY DIFFRA

[8] Electrodeposition of β′-brass from cyanide baths with accumulative underpotential deposition of Zn [J].

Fujiwara, Y ;

Enomoto, H .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2000, 147 (05) :1840-1846

[9] Composite plating of Sn-Ag alloys for Pb-free soldering [J].

Fujiwara, Y ;

Enomoto, H ;

Nagao, T ;

Hoshika, H .

SURFACE & COATINGS TECHNOLOGY, 2003, 169 :100-103

[10] Sn deposition onto Cu and alloy layer growth by a contact immersion process [J].

Fujiwara, Y .

THIN SOLID FILMS, 2003, 425 (1-2) :121-126

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