On the Solid Solubility Extension by Rapid Quenching and Spinodal Decomposition during Aging in Melt-Spun Cu-Ti Alloys

被引:4
|
作者
Kondo, Shin-ichiro [1 ]
Nakashima, Hiromichi [1 ]
Morimura, Takao [1 ]
机构
[1] Nagasaki Univ, Dept Mat Sci & Engn, Fac Engn, Nagasaki 8528521, Japan
关键词
melt-spun; sideband; Cu-Ti alloy; spinodal decomposition; solid solubility extension; ELECTRICAL-CONDUCTIVITY; MECHANICAL-PROPERTIES; CR ALLOYS; SIDE-BAND; COPPER; PHASE; MICROSTRUCTURE; PRECIPITATION; WAVELENGTH; CRYSTALS;
D O I
10.2320/matertrans.M2018255
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
We have examined solid solubility extension for melt-spun Cu-Ti alloys (4, 6, 7, and 8 mass% Ti) in comparison with that for conventional quenched alloys. X-ray diffraction (XRD) measurements revealed that the solid solubility extension for the melt-spun alloys was in the range of 7-8 mass% Ti, whereas that for quenched alloys was less than 6 mass% Ti. After annealing the melt-spun alloys at 673 K, the XRD measurements revealed sidebands with no intermetallic compound peaks, bright-field transmission electron microscopy images showed modulated structures, and selected-area diffraction patterns exhibited satellite structures; taken together, these experimental results confirm the occurrence of spinodal decomposition. In this study, however, distinct superlattice reflections were not observed.
引用
收藏
页码:338 / 345
页数:8
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