Optimization the Machining Parameters of Surface Roughness During Micro- EDM Method

被引：10

作者：

Khare, Sanchit Kumar ^{[1
]}

Phull, Gurpreet Singh ^{[1
]}

Agarwal, Sanjay ^{[2
]}

机构：

[1] Lovely Profess Univ, Sch Mech Engn, Jalandhar Delhi GT Rd, Phagwara 144411, Punjab, India

[2] Bundelkhand Inst Engn & Technol, Mech Engn Dept, Jhansi 284128, Uttar Pradesh, India

来源：

MATERIALS TODAY-PROCEEDINGS | 2020年 / 27卷

关键词：

SILICON;

D O I：

10.1016/j.matpr.2019.11.279

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：475 / 479

页数：5

共 11 条

[1]

[Anonymous], 1964, ELECTROSPARK MACHINI

[2]

Chan ML, 2012, PROC IEEE MICR ELECT

[3]

Gupta Y, 2014, 2014 INTERNATIONAL CONFERENCE ON COMPUTING FOR SUSTAINABLE GLOBAL DEVELOPMENT (INDIACOM), P1, DOI 10.1109/IndiaCom.2014.6828002

[4] A review on the conventional and micro-electrodischarge machining of tungsten carbide [J].

Jahan, M. P. ;

Rahman, M. ;

Wong, Y. S. .

INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2011, 51 (12) :837-858

[5] A study on the fine-finish die-sinking micro-EDM of tungsten carbide using different electrode materials [J].

Jahan, M. P. ;

Wong, Y. S. ;

Rahman, M. .

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2009, 209 (08) :3956-3967

[6] Optimization of Machining Parameters in Turning of AISI 4340 Steel under Cryogenic Condition Using Taguchi Technique [J].

Khare, Sanchit Kumar ;

Agarwal, Sanjay .

MANUFACTURING SYSTEMS 4.0, 2017, 63 :610-614

[7] Removal mechanisms in polishing of silicon based advanced ceramics [J].

Klocke, Fritz ;

Zunke, Richard .

CIRP ANNALS-MANUFACTURING TECHNOLOGY, 2009, 58 (01) :491-494

[8] Carbon nanofiber assisted micro electro discharge machining of reaction-bonded silicon carbide [J].

Liew, Pay Jun ;

Yan, Jiwang ;

Kuriyagawa, Tsunemoto .

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2013, 213 (07) :1076-1087

[9] Machining of three-dimensional microstructures in silicon by electrodischarge machining [J].

Reynaerts, D ;

Meeusen, W ;

Van Brussel, H .

SENSORS AND ACTUATORS A-PHYSICAL, 1998, 67 (1-3) :159-165

[10] Surface characterization, material removal mechanism and material migration study of micro EDM process on conductive SiC [J].

Saxena, Krishna Kumar ;

Agarwal, Sanjay ;

Khare, Sanchit Kumar .

18TH CIRP CONFERENCE ON ELECTRO PHYSICAL AND CHEMICAL MACHINING (ISEM XVIII), 2016, 42 :179-184

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