Thermal stability and annealing behaviour of ultrafine grained commercially pure titanium

被引：57

作者：

Hoseini, Majid ^{[1
]}

Pourian, Meysam Hamid ^{[1
]}

Bridier, Florent ^{[1
]}

Vali, Hojatollah ^{[2
]}

Szpunar, Jerzy A. ^{[3
]}

Bocher, Philippe ^{[1
]}

机构：

[1] Ecole Technol Super, Montreal, PQ H3C 1K3, Canada

[2] McGill Univ, McGill Inst Adv Mat, Montreal, PQ H3A 2B2, Canada

[3] Univ Saskatchewan, Dept Mech Engn, Saskatoon, SK S7N 5A9, Canada

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2012年 / 532卷

关键词：

Titanium; Grain growth; Kinetics; UFG; EBSD; TEM; HIGH-PRESSURE TORSION; LOW-CARBON STEEL; MECHANICAL-PROPERTIES; SC ALLOY; ECAP; MICROSTRUCTURE; DEFORMATION; GROWTH; TI; COPPER;

D O I：

10.1016/j.msea.2011.10.062

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Ultrafine grained (UFG) commercially pure titanium was fabricated by 8 successive passes of equal channel angular pressing (ECAP) via route B-C. The deformed structure was studied by transmission electron microscopy (TEM). The material was then annealed at a range of temperature (450-600 degrees C) for up to 6h. The microstructure evolution and the grain growth behaviour were investigated by electron back scattered diffraction (EBSD) technique. The UFG titanium was found to be thermally stable up to 450 degrees C. Based on the experimental results, the grain growth kinetics was characterized by calculating the grain growth activation energy (Q) and the time exponent (n). The value of Q was found to be close to the self diffusion activation energy of titanium, while n was found to be lower than the time exponent reported for grain growth in coarse grained pure titanium. (C) 2011 Elsevier B.V. All rights reserved.

引用

页码：58 / 63

页数：6

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