Plating technology for fluorocarbon polymer films using atmospheric-pressure nonthermal plasma graft polymerization

被引：19

作者：

Okubo, Masaaki ^{[1
]}

Tahara, Mitsuru ^{[2
]}

Kuroki, Tomoyuki ^{[1
]}

Hibimo, Toshitomo ^{[1
]}

Saeki, Noboru ^{[3
]}

机构：

[1] Osaka Prefecture Univ, Dept Mech Engn, Naka Ku, Sakai, Osaka 5998531, Japan

[2] Technol Res Inst Osaka Prefecture, Environm & Chem Dept, Osaka 5941157, Japan

[3] Pearl Kogyo Co Ltd, Lab Technol Dev, Suminoe Ku, Osaka 5590015, Japan

来源：

JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY | 2008年 / 21卷 / 02期

关键词：

nonthermal plasma; plating; fluorocarbon polymer; graft-polymerization;

D O I：

10.2494/photopolymer.21.219

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

A low-environmental load surface modification technique for plating the fluorocarbon polymers films is developed using an atmospheric-pressure argon and acrylic acid vapor nonthermal plasma graft polymerization. The results of the T-type peeling test show that the peeling strength of copper plating on the treated PTFE (polytetrafluoroethylene) film is approximately 46 times greater than that on the untreated film. With scanning electron microscope analysis of the surface of the copper plating on the treated PTFE, it is confirmed that the hydrophilic surface of the treated film contributes to uniform copper plating.

引用

页码：219 / 224

页数：6

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