Self-healing thermoset using encapsulated epoxy-amine healing chemistry

被引：262

作者：

Jin, Henghua ^{[1
,3
]}

Mangun, Chris L. ^{[2
]}

Stradley, Dylan S.

Moore, Jeffrey S. ^{[3
]}

Sottos, Nancy R. ^{[3
]}

White, Scott R. ^{[1
,3
]}

机构：

[1] Univ Illinois, Dept Aerosp Engn, Urbana, IL 61801 USA

[2] CU Aerosp, Champaign, IL 61820 USA

[3] Univ Illinois, Beckman Inst, Urbana, IL 61801 USA

来源：

POLYMER | 2012年 / 53卷 / 02期

关键词：

Hollow microcapsule; Amine microcapsule; Fracture toughness; MICROENCAPSULATION; MICROCAPSULES;

D O I：

10.1016/j.polymer.2011.12.005

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

Self-healing was achieved with a dual-microcapsule epoxy-amine chemistry in thermoset epoxy. One capsule contained a modified aliphatic polyamine (EPIKURE 3274) while the second capsule contained a diluted epoxy monomer (EPON 815C). Amine microcapsules were prepared by vacuum infiltration of EPIKURE 3274 into hollow polymeric microcapsules. Epoxy microcapsules were prepared by an in situ polymerization method. Both types of capsules were incorporated into an epoxy matrix (EPON 828:DETA) and recovery of mode-I fracture toughness was measured using tapered-double-cantilever-beam (TDCB) specimens. The optimal mass ratio of amine: epoxy capsules was 4: 6 and an average healing efficiency of 91% was achieved with 7 wt% amine capsules and 10.5 wt% epoxy capsules. Longterm stability of the healing system was demonstrated for six months at ambient conditions. Thermal stability was investigated by post curing samples at 121 degrees C and assessing healing performance. (C) 2011 Elsevier Ltd. All rights reserved.

引用

页码：581 / 587

页数：7

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