Design Challenges for Sense Amplifier and Wireless Link in High-Density Neural Recording Implants

被引:0
作者
Elzeftawi, Mohamed N. [1 ]
Yue, C. Patrick [1 ]
Theogarajan, Luke [1 ]
机构
[1] Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA
来源
2010 INTERNATIONAL SYMPOSIUM ON VLSI DESIGN AUTOMATION AND TEST (VLSI-DAT) | 2010年
关键词
INSTRUMENTATION AMPLIFIER; SYSTEM; CHIP; TEMPERATURE; NEURONS; TISSUE; SIGNAL; UNIT;
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
In this paper we discuss the challenges in designing high-density biomedical neural implants. We discuss in more detail the constraints of the sense amplifier and the wireless link. Different techniques to design the front-end low-noise sense amplifier are discussed. We compare between different wireless designs and we show that trading off the transmitter power consumption and complexity with that of the external receiver will be mandatory to minimize the power dissipation and area of the implant.
引用
收藏
页码:61 / 64
页数:4
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