A Novel Compact Electromagnetic Bandgap Structure in Power Plane for Wideband Noise Suppression and Low Radiation

被引：36

作者：

Rao, Patnam Hanumantha ^{[1
]}

Swaminathan, Madhavan ^{[2
]}

机构：

[1] SAMEER Ctr Electromagnet, Madras 600113, Tamil Nadu, India

[2] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA

来源：

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY | 2011年 / 53卷 / 04期

关键词：

Electromagnetic bandgap; electromagnetic interference (EMI); noise suppression; signal integrity (SI); SIMULTANEOUS SWITCHING NOISE; GROUND BOUNCE NOISE; MITIGATION; REDUCTION; DESIGN;

D O I：

10.1109/TEMC.2011.2156408

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A compact reduced unit cell size electromagnetic bandgap (EBG) power plane, realized with a combination of alternating impedance EBG and multiple narrow slits, is presented. By concatenating 2 x 2 high-frequency unit cells, a virtual low-frequency EBG unit cell is synthesized without changing the overall dimensions. In this configuration, the basic slit in the high-frequency unit cell remained same, and an additional slit with longer dimensions is added in parallel to the basic slit by synthesizing a larger low-frequency unit cell. EBG is characterized for its dispersion diagram, noise suppression, signal integrity, and electromagnetic radiation. Fabricated EBG exhibits a bandgap from 0.9 to 3.5 GHz with isolation better than -40 dB over the band. Radiated emission of the new EBG is small with an average value of 35 dB.uV/m. Compact EBG also exhibits low impedance, which is less than 1 Omega over the stopband. Eye patterns are generated to analyze signal integrity issues when the data lines are referenced over the solid ground plane and EBG plane. The degradation of the maximum eye opening and the maximum eye width for the proposed EBG power plane at 2 Gb/s data rate is about 17.8% and 1%, respectively, with reference to the equivalent board with solid power plane.

引用

页码：996 / 1004

页数：9

共 28 条

[1] Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits [J].

Abhari, R ;

Eleftheriades, GV .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2003, 51 (06) :1629-1639

[2]

*ANS CORP, 2006, HIGH FREQ STRUCT SIM

[3]

Choi J, 2005, IEEE MTT S INT MICR, P849

[4]

Hung K. C., 2007, P INT C INF COMM SYS

[5] A S-bridged inductive electromagnetic bandgap power plane for suppression of ground bounce noise [J].

Joo, Sung-Ho ;

Kim, Dong-Yeop ;

Lee, Hai-Young .

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2007, 17 (10) :709-711

[6] A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface [J].

Kamgaing, T ;

Ramahi, OM .

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2003, 13 (01) :21-23

[7] An efficient path-based equivalent circuit model for design, synthesis, and optimization of power distribution networks in multilayer printed circuit boards [J].

Kim, YJ ;

Yoon, HS ;

Lee, S ;

Moon, G ;

Kim, J ;

Wee, JK .

IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2004, 27 (01) :97-106

[8] Novel Electromagnetic Bandgap Array Structure on Power Distribution Network for Suppressing Simultaneous Switching Noise and Minimizing Effects on High-Speed Signals [J].

Kwon, Jong Hwa ;

Sim, Dong Uk ;

Kwak, Sang Il ;

Yook, Jong Gwan .

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2010, 52 (02) :365-372

[9] Signal integrity issues at split ground and power planes [J].

Liaw, HJ ;

Merkelo, H .

46TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1996 PROCEEDINGS, 1996, :752-755

[10] Methods to reduce radiation from split ground planes in RF and mixed signal packaging structures [J].

Moran, TE ;

Virga, KL ;

Aguirre, G ;

Prince, JL .

IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2002, 25 (03) :409-416

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