High-throughput characterization of mechanical properties of Ti-Ni-Cu shape memory thin films at elevated temperature

被引:19
作者
Zarnetta, R. [1 ]
Kneip, S. [1 ]
Somsen, Ch [1 ]
Ludwig, A. [1 ]
机构
[1] Ruhr Univ Bochum, Inst Mat, Fac Mech Engn, D-44801 Bochum, Germany
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2011年 / 528卷 / 21期
关键词
Nanoindentation; Martensitic transformation; Shape memory alloys; Hardness measurements; Precipitation; Combinatorial materials science; ELASTIC-MODULUS; MARTENSITIC-TRANSFORMATION; INSTRUMENTED INDENTATION; THERMAL-EXPANSION; BULGE TEST; BEHAVIOR; FABRICATION; NANOINDENTATION; MICROSTRUCTURE; COMBINATORIAL;
D O I
10.1016/j.msea.2011.05.006
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Hardness and Young's moduli values for TixNi90-xCu10 (37 at.% < x < 67 at.%) thin films from a continuous composition spread type materials library, annealed at 500 C for 1 h, were determined at room temperature (martensitic state) and 80 degrees C (austenitic state) using high-throughput nanoindentation experiments. These values are found to increase as the compositions deviate from Ti contents close to 50 at.%. The increases in hardness is correlated to the presence of Ti-rich and(Ni,Cu)-rich precipitates resulting in precipitate hardening and grain size refinement (Hall-Petch effect). The increase of the Young's moduli is rationalized by considering the significantly higher Young's moduli of the different precipitate phases and applying the rule of mixtures. The contributions of the precipitate phases and the matrix to the combined Young's modulus were estimated by evaluating the load-displacement curves in detail. The obtained results are in good agreement with the Young's moduli determined from thin film curvature measurements [R. Zarnetta et al., Smart Mater. Struct. 19 (2010) 65032]. Thus, the experimental restrictions for nanoindentation experiments at elevated temperatures are concluded to not adversely affect the validity of the results. (C) 2011 Elsevier B.V. All rights reserved.
引用
收藏
页码:6552 / 6557
页数:6
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