Improved eigenmode expansion method for investigating of ground bounce in power/ground plane with holes in PCBs

被引：0

作者：

Qiao, Ming-Yue ^{[1
]}

Yin, Wen-Yan ^{[1
]}

Mao, Jun-Fa ^{[1
]}

机构：

[1] Shanghai Jiao Tong Univ, Ctr Microwave & RF Technol, Shanghai 200240, Peoples R China

来源：

2008 ASIA-PACIFIC SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY AND 19TH INTERNATIONAL ZURICH SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1 AND 2 | 2008年

关键词：

D O I：

10.1109/APEMC.2008.4559941

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An improved eigenmode expansion method (EEM) is proposed for analyzing power/ground plane pairs in high-speed printed circuit boards (PCB). We notice that the EEM is only applicable for regular structures in a PCB, such as rectangular and circular geometries, and it costs much computational time. Therefore, asymptotic waveform evaluation (AWE) technique and inverted composition method are combined with the EEM for capturing frequency-dependent transfer and self impedances of the power/ground plane with single or even many holes. The simulation results show that good agreements are achieved between our results and those obtained by finite-element method (FEM).

引用

页码：578 / 581

页数：4

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