Improved eigenmode expansion method for investigating of ground bounce in power/ground plane with holes in PCBs

被引:0
|
作者
Qiao, Ming-Yue [1 ]
Yin, Wen-Yan [1 ]
Mao, Jun-Fa [1 ]
机构
[1] Shanghai Jiao Tong Univ, Ctr Microwave & RF Technol, Shanghai 200240, Peoples R China
来源
2008 ASIA-PACIFIC SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY AND 19TH INTERNATIONAL ZURICH SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1 AND 2 | 2008年
关键词
D O I
10.1109/APEMC.2008.4559941
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
An improved eigenmode expansion method (EEM) is proposed for analyzing power/ground plane pairs in high-speed printed circuit boards (PCB). We notice that the EEM is only applicable for regular structures in a PCB, such as rectangular and circular geometries, and it costs much computational time. Therefore, asymptotic waveform evaluation (AWE) technique and inverted composition method are combined with the EEM for capturing frequency-dependent transfer and self impedances of the power/ground plane with single or even many holes. The simulation results show that good agreements are achieved between our results and those obtained by finite-element method (FEM).
引用
收藏
页码:578 / 581
页数:4
相关论文
共 50 条
  • [1] Application of the Pade approximation to the eigenmode expansion method for the power/ground plane pair analysis
    Liu, Ping
    Li, Zheng-Fan
    2005 ASIA-PACIFIC MICROWAVE CONFERENCE PROCEEDINGS, VOLS 1-5, 2005, : 1284 - 1286
  • [2] Application of the eigen-mode expansion method to power/ground plane structures with holes
    Liu, P
    Li, ZF
    IEICE TRANSACTIONS ON ELECTRONICS, 2005, E88C (04) : 739 - 743
  • [3] Investigation of ground bounce effect on PCBs
    Fung, LC
    Leung, SW
    Wan, LX
    Siu, YM
    Chan, KH
    MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2002, 32 (04) : 259 - 264
  • [4] An efficient method for calculating bounces in the irregular power/ground plane structure with holes in high-speed PCBs
    Liu, P
    Li, ZF
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2005, 47 (04) : 889 - 898
  • [5] Study of the ground bounce caused by power plane resonances
    Van den Berghe, S
    Olyslager, F
    De Zutter, D
    De Moerloose, J
    Temmerman, W
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 1998, 40 (02) : 111 - 119
  • [6] Application of segmentation method to analysis of power/ground plane resonance in multilayer PCBs
    Wang, ZL
    Wada, O
    Toyota, Y
    Koga, R
    2002 3RD INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, 2002, : 775 - 778
  • [7] Investigating the global suppression of the power/ground plane noise
    Abhari, R
    Eleftheriades, GV
    SIGNAL PROPAGATION ON INTERCONNECTS, PROCEEDINGS, 2004, : 209 - 210
  • [8] Analytical calculation of impedance of Power/Ground plane with circular holes
    Wang, Hanfeng
    Wang, Qiang
    2007 4TH INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY PROCEEDING: EMC 2007, 2007, : 547 - 550
  • [9] Power and ground bounce reduction in buffers
    Department of Electrical Engineering, Universidad Autónoma Metropolitana, Av. R. Atlixco 186, Col. Vicenta, Iztapalapa 09340 D.F., Mexico
    不详
    WSEAS Trans. Electron., 2006, 9 (478-483):
  • [10] Composite effects of reflections and ground bounce for signal line through a split power plane
    Wu, CT
    Shiue, GH
    Lin, SM
    Wu, RB
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2002, 25 (02): : 297 - 301