Recent Advances on Thermal Management of Flexible Inorganic Electronics

Flexible inorganic electronic devices (FIEDs) consisting of functional inorganic components on a soft polymer substrate have enabled many novel applications such as epidermal electronics and wearable electronics, which cannot be realized through conventional rigid electronics. The low thermal dissipation capacity of the soft polymer substrate of FIEDs demands proper thermal management to reduce the undesired thermal influences. The biointegrated applications of FIEDs pose even more stringent requirements on thermal management due to the sensitive nature of biological tissues to temperature. In this review, we take microscale inorganic light-emitting diodes (mu-ILEDs) as an example of functional components to summarize the recent advances on thermal management of FIEDs including thermal analysis, thermo-mechanical analysis and thermal designs of FIEDs with and without biological tissues. These results are very helpful to understand the underlying heat transfer mechanism and provide design guidelines to optimize FIEDs in practical applications.