Comparison study on microstructure and mechanical properties of Sn-10Bi and Sn-Ag-Cu solder alloys and joints

被引：10
作者：
Guo, Qinhan [1 ]
Zhao, Zhenjiang [1 ]
Shen, Chunlong [1 ]
机构：
[1] Taizhou Univ, Sch Shipping & Mechatron Engn, Taizhou 225300, Jiangsu, Peoples R China
来源：
MICROELECTRONICS RELIABILITY | 2017年 / 78卷
关键词：
Sn-10Bi; Sn-Ag-Cu; Strength; Creep; Bending; Fracture mode; CREEP-BEHAVIOR; RELIABILITY; STRENGTH; GROWTH; BI;
D O I：
10.1016/j.microrel.2017.08.004
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The comparison study of Sn-10Bi and Sn-3.0Ag-0.5Cu solder alloys and joints was conducted. The results showed that the liquidus of Sn-10Bi solder alloy was lower than that of Sn-Ag-Cu slightly. The interfacial IMCs layer growth of Sn-10Bi/Cu was slower than that of Sn-Ag-Cu/Cu during liquid/solid reaction. The higher strength and lower creep strain rate of Sn-10Bi comparing with that of Sn-Ag-Cu were contributed by the solid solution strengthening effect of Bi atom in beta-Sn phase. The ultimate bending load of Sn-10Bi joint was higher than that of Sn-Ag-Cu joint as the high strength of Sn-10Bi solder alloy. Moreover, the thinner and more flat IMCs layer also ensured the stable maximum bending displacement of Sn-10Bi joint at a loading speed of 1 mm/s compared with that of Sn-Ag-Cu joint. (C) 2017 Elsevier Ltd. All rights reserved.
引用
收藏
页码：72 / 79
页数：8
相关论文
共 25 条
  • [1] Development of new multicomponent Sn-Ag-Cu-Bi lead-free solders for low-cost commercial electronic assembly
    El-Daly, A. A.
    El-Taher, A. M.
    Gouda, S.
    [J]. JOURNAL OF ALLOYS AND COMPOUNDS, 2015, 627 : 268 - 275
  • [2] Physicochemical Properties of Sn-Zn and SAC+Bi Alloys
    Gancarz, Tomasz
    Pstrus, Janusz
    Gasior, Wladyslaw
    Henein, Hani
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2013, 42 (02) : 288 - 293
  • [3] Microstructure and impression creep behavior of lead-free Sn-5Sb solder alloy containing Bi and Ag
    Geranmayeh, A. R.
    Nayyeri, G.
    Mahmudi, R.
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2012, 547 : 110 - 119
  • [4] Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints
    Ghosh, Rituparna
    Kanjilal, Anwesha
    Kumar, Praveen
    [J]. MICROELECTRONICS RELIABILITY, 2017, 74 : 44 - 51
  • [5] Solder joint reliability and characteristics of deformation and crack growth of Sn-Ag-Cu versus eutectic Sn-Pb on a WLP in a thermal cycling test
    Kim, DH
    Elenius, P
    Barrett, S
    [J]. IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2002, 25 (02): : 84 - 90
  • [6] Kim H., 2007, EL COMP TECHN C 2007
  • [7] Microstructure and mechanical properties of Co/Sn-10Bi couple and Co/Sn-10Bi/Co joint
    Lai, Zhongmin
    Kong, Xinda
    You, Qingrong
    Cao, Xiubin
    [J]. MICROELECTRONICS RELIABILITY, 2017, 68 : 69 - 76
  • [8] Microstructure and Properties of Sn-10Bi-xCu Solder Alloy/Joint
    Lai, Zhongmin
    Ye, Dan
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2016, 45 (07) : 3702 - 3711
  • [9] Microstructure and fracture behavior of non eutectic Sn-Bi solder alloys
    Lai, Zhongmin
    Ye, Dan
    [J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016, 27 (04) : 3182 - 3192
  • [10] Effect of cooling method and aging treatment on the microstructure and mechanical properties of Sn-10Bi solder alloy
    Lai, Zhongmin
    Ye, Dan
    [J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016, 27 (02) : 1398 - 1407
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