Fabrication of copper/single-walled carbon nanotube composite film with homogeneously dispersed nanotubes by electroless deposition

Copper/single-walled carbon nanotube (SWCNT) composite films were fabricated by electroless deposition. The SWCNTs were formed using the water-assisted chemical vapor deposition method. To prepare copper/SWCNT composite plating baths with homogeneously dispersed SWCNTs, magnetic stirring, ultrasonic homogenization, and collision-type atomization were examined as mechanical methods for the disintegration of SWCNT bundles. Appropriate dispersants were added to the plating baths to avoid re-aggregation of the disintegrated SWCNTs. The degree of SWCNT dispersion in the copper/SWCNT composite plating bath was evaluated using a particle size analyzer, and the microstructures of the copper/SWCNT composite films were analyzed using scanning electron microscopy and X-ray diffraction. Collision-type atomization most significantly improved the degree of SWCNT dispersion in the composite plating bath. Using this treatment method, copper/SWCNT composite films with homogeneous dispersions of SWCNTs were successfully fabricated by electroless deposition. (C) 2016 The Authors. Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://cleativecommonhorghicensehby-nc-nd74,0/).