Liquid metal represents a highly conductive and inherently deformable conductor for the development of stretchable electronics. The widespread implementations of liquid metal towards functional sensors and circuits are currently hindered by the lack of a facile and scalable patterning approach. In this study, we report a fully solution-based process to generate patterned features of the liquid metal conductor. The entire process is carried out under ambient conditions and is generally compatible with various elastomeric substrates. The as-prepared liquid metal feature exhibits high resolution (100 mu m), excellent electrical conductivity (4.15 x 10(4)S cm(-1)), ultrahigh stretchability (1000% tensile strain), and mechanical durability. The practical suitability is demonstrated by the heterogeneous integration of light-emitting diode (LED) chips with liquid metal interconnects for a stretchable and wearable LED array. The solution-based technique reported here is the enabler for the facile patterning of liquid metal features at low cost, which may find a broad range of applications in emerging fields of epidermal sensors, wearable heaters, advanced prosthetics, and soft robotics.
机构:
Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Yale Univ, Dept Mech Engn & Mat Sci, New Haven, CT 06511 USAPurdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Liu, Shanliangzi
Yuen, Michelle C.
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机构:
Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Yale Univ, Dept Mech Engn & Mat Sci, New Haven, CT 06511 USAPurdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Yuen, Michelle C.
White, Edward L.
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h-index: 0
机构:
Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USAPurdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
White, Edward L.
Boley, J. William
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机构:
Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Boston Univ, Dept Mech Engn, Boston, MA 02215 USAPurdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Boley, J. William
Deng, Biwei
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机构:
Purdue Univ, Sch Ind Engn, W Lafayette, IN 47907 USAPurdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Deng, Biwei
Cheng, Gary J.
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h-index: 0
机构:
Purdue Univ, Sch Ind Engn, W Lafayette, IN 47907 USAPurdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Cheng, Gary J.
Kramer-Bottiglio, Rebecca
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机构:
Yale Univ, Dept Mech Engn & Mat Sci, New Haven, CT 06511 USAPurdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
机构:
Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Yale Univ, Dept Mech Engn & Mat Sci, New Haven, CT 06511 USAPurdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Liu, Shanliangzi
Yuen, Michelle C.
论文数: 0引用数: 0
h-index: 0
机构:
Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Yale Univ, Dept Mech Engn & Mat Sci, New Haven, CT 06511 USAPurdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Yuen, Michelle C.
White, Edward L.
论文数: 0引用数: 0
h-index: 0
机构:
Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USAPurdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
White, Edward L.
Boley, J. William
论文数: 0引用数: 0
h-index: 0
机构:
Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Boston Univ, Dept Mech Engn, Boston, MA 02215 USAPurdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Boley, J. William
Deng, Biwei
论文数: 0引用数: 0
h-index: 0
机构:
Purdue Univ, Sch Ind Engn, W Lafayette, IN 47907 USAPurdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Deng, Biwei
Cheng, Gary J.
论文数: 0引用数: 0
h-index: 0
机构:
Purdue Univ, Sch Ind Engn, W Lafayette, IN 47907 USAPurdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Cheng, Gary J.
Kramer-Bottiglio, Rebecca
论文数: 0引用数: 0
h-index: 0
机构:
Yale Univ, Dept Mech Engn & Mat Sci, New Haven, CT 06511 USAPurdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA