New techniques for the design of advanced ultrasonic transducers for wire bonding

被引:26
|
作者
Parrini, L [1 ]
机构
[1] ESEC SA, CH-6330 Cham, Switzerland
关键词
FEM simulations; fine pitch; ultrasonic transducers; ultrasonic welding; ultrasounds; wire bonder; wire bonding;
D O I
10.1109/TEPM.2003.813001
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A new high-frequency ultrasonic transducer, in particular for the application wire-bonding, has been conceived, designed, prototyped, and tested. In the design phase an advanced approach was used and established. The method, is based on the two basic principles of modularity and iteration. The transducer is decomposed in its elementary components. For each component an initial draft is obtained with finite-elements-method simulations (FEM). The simulated ultrasonic modules are then built and characterized experimentally through laser-interferometry measurements and electrical resonance spectra. The comparison of simulation results with experimental data allows the parameters of FEM models to be iteratively adjusted and optimized. The achieved FEM simulations exhibit a remarkably high predictive potential and allow full control on the vibration behavior of the ultrasonic modules and of the whole transducer. The new transducer is fixed on the welding device with a flange whose special geometry was calculated by means of FEM simulations. This flange allows the converter to be attached on the welding device not only in longitudinal nodes but also in radial nodes of the ultrasonic field excited in the horn. This leads to a total decoupling of the transducer to the welding device, which has so far been unheard of. The new approach to mount ultrasonic transducers on a welding-device is of major importance not only for wire-bonding but-also for all high-power ultrasound applications and has been patented.
引用
收藏
页码:37 / 45
页数:9
相关论文
共 50 条
  • [21] Evaluation of bonding techniques for ultrasound transducers
    Bolstad, Per Kristian
    Frijlink, Martijn
    Hoff, Lars
    MICROELECTRONICS RELIABILITY, 2023, 151
  • [22] LIQUIDS FOR BONDING ULTRASONIC TRANSDUCERS AT LOW TEMPERATURES
    MATHESON, AJ
    JOURNAL OF PHYSICS E-SCIENTIFIC INSTRUMENTS, 1971, 4 (10): : 796 - &
  • [23] Vibration and resonance characteristics of PZT/epoxy 1-3 composite ultrasonic wire bonding transducers
    Chong, CP
    Chan, HLW
    Liu, PCK
    PRICM 4: FORTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, VOLS I AND II, 2001, : 1579 - 1582
  • [24] New Techniques and Designs of Focusing Piezoelectric Transducers for Ultrasonic Diagnostics and Therapy
    Shvetsova N.A.
    Makarev D.I.
    Shvetsov I.A.
    Shcherbinin S.A.
    Rybyanets A.N.
    Bulletin of the Russian Academy of Sciences: Physics, 2018, 82 (03) : 251 - 256
  • [25] DESIGN OF PIEZOCOMPOSITES FOR ULTRASONIC TRANSDUCERS
    SMITH, WA
    SHAULOV, AA
    AULD, BA
    FERROELECTRICS, 1989, 91 : 155 - 162
  • [26] EFFECT OF ULTRASONIC VIBRATION ON WIRE BONDING
    HAJI, H
    MORITA, T
    NAKASHIMA, H
    YOSHINAGA, H
    JOURNAL OF THE JAPAN INSTITUTE OF METALS, 1993, 57 (08) : 884 - 889
  • [27] ULTRASONIC BONDING OF INSULATED WIRE.
    Hulst, A.P.
    Lasance, C.
    Welding Journal (Miami, Fla), 1978, 57 (02): : 19 - 25
  • [28] Design of High-Frequency Ultrasonic Transducers With Flexure Decoupling Flanges for Thermosonic Bonding
    Wang, Fujun
    Zhang, Hongjie
    Liang, Cunman
    Tian, Yanling
    Zhao, Xingyu
    Zhang, Dawei
    IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 2016, 63 (04) : 2304 - 2312
  • [29] The effect of ultrasonic power on bonding pad and IMD layers in ultrasonic wire bonding
    Jeon, IS
    Chung, QH
    Hong, JK
    Lyun, KY
    ADVANCES IN ELECTRONIC MATERIALS AND PACKAGING 2001, 2001, : 235 - 242
  • [30] Advanced Wire Bonding Technology for Ag Wire
    Shah, Aashish
    Rockey, Thomas
    Xu, Hui
    Qin, Ivy
    Jie, Wu
    Yauw, Oranna
    Chylak, Bob
    2015 IEEE 17TH ELECTRONICS PACKAGING AND TECHNOLOGY CONFERENCE (EPTC), 2015,