共 50 条
- [12] Advanced process characterization for 125 kHz wire bonder ultrasonic transducers IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2002, 25 (03): : 486 - 494
- [14] Design optimization of wire bonding for advanced packaging 53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 1364 - 1372
- [15] New wire design requirements for wire bonding applications 1996 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 1996, 2920 : 450 - 455
- [16] Design Methodology of High Frequency Ultrasonic Transducer for Wire Bonding 2008 INTERNATIONAL CONFERENCE ON MECHATRONICS AND AUTOMATION: (ICMA), VOLS 1 AND 2, 2008, : 999 - 1004
- [19] Novel ultrasonic transducer design for fine-pitch wire bonding IEEE/CPMT/SEMI(R) 28TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 2003, : 49 - 53