A Simple Test Method for Electromigration Reliability of Solder/Cu Pillar Bumps Using Flat Cables

被引：0

作者：

Azuma, Naoki ^{[1
]}

Owada, Misaki ^{[1
]}

Abe, Takumi ^{[1
]}

Nakada, Tsutomu ^{[3
]}

Kubota, Makoto ^{[3
]}

Ueno, Kazuyoshi ^{[1
,2
]}

机构：

[1] Shibaura Inst Technol, Koto Ku, Tokyo, Japan

[2] Res Ctr Green Innovat, Koto Ku, Tokyo, Japan

[3] EBARA Corp, Fujisawa, Kanagawa, Japan

来源：

2017 IEEE ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING CONFERENCE (EDTM) | 2017年

关键词：

EM; reliability; Cu pillar; solder; bump;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

To evaluate electromigration (EM) reliability of solder/copper (Cu) pillar bumps, a simple and low-cost test method using a flat cable has been developed. The EM lifetime of the pillar bumps with differently plated structures or different plating chemicals were compared. The results show the different lifetime distributions depending on the different structures or plating chemicals. From the results, the developed test method is considered to be effective for evaluating the EM reliability in a process development such as optimization of plating chemicals.

引用

页码：270 / 272

页数：3

共 4 条

[1] Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint
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[J]. MICROELECTRONICS RELIABILITY, 2011, 51 (12) : 2290 - 2297
[2] Effect of UBM thickness on the mean time to failure of flip-chip solder joints under electromigration
Lin, Y. L.
Lai, Y. S.
Lin, Y. W.
Kao, C. R.
[J]. JOURNAL OF ELECTRONIC MATERIALS, 2008, 37 (01) : 96 - 101
[3] Osawa T., 2012, HANDAZUKE KOUGAKU
[4] Yeoh A., 2006, P IEEE 2006 ECTC

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