Fabrication of normally-off mode GaN and AlGaN/GaN MOSFETs with HfO2 gate insulator

被引:33
|
作者
Sugiura, S. [1 ]
Hayashi, Y. [1 ]
Kishimoto, S. [1 ,2 ]
Mizutani, T. [1 ]
Kuroda, M. [3 ]
Ueda, T. [3 ]
Tanaka, T. [3 ]
机构
[1] Nagoya Univ, Dept Quantum Engn, Chikusa Ku, Nagoya, Aichi 4648603, Japan
[2] Nagoya Univ, Venture Business Lab, Chikusa Ku, Nagoya, Aichi 4648603, Japan
[3] Panasonic Corp, Semicond Device Res Ctr, Semicond Co, Nagaokakyou 6178520, Japan
基金
日本学术振兴会;
关键词
HfO2; AlGaN/GaN; MOSFET; Normally-off; VOLTAGE; HEMTS;
D O I
10.1016/j.sse.2009.10.007
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We have fabricated III-nitride metal-oxide field effect transistors (MOSFETs) using high-k HfO2 as a gate oxide. Two types of MOSIFETs were studied; GaN MOSIFETs and AlGaN/GaN MOSFETs. In the case of GaN MOSIFETs, the maximum transconductance of 45 mS/mm has been obtained. This is seven times larger than the best-reported value, to our knowledge, for the normally-off GaN MOSIFETs with SiO2 gate oxide. In order to improve the performance of the device, AlGaN/GaN MOSFETs in which high-quality AlGaN/GaN heterointerface is used as a channel have been fabricated. The maximum transconductance and drain current were as high as 160 mS/mm and 840 mA/mm, respectively. (C) 2009 Elsevier Ltd. All rights reserved.
引用
收藏
页码:79 / 83
页数:5
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