Development and performance analysis of novel in situ Cu-Ni/Al2O3 nanocomposites

Cu-Ni/Al2O3 nanocomposite powders were manufactured using an in situ chemical reaction technique. This technique provides improved wettability and adhesion between the matrix and reinforcement phases. Aluminum nitrate, copper nitrate and nickel nitrate were used as start materials for the production of the composites. The powders were sintered in a hydrogen environment at 900 C for 2 h after being cold pressed at 700 MPa. To determine the effect of Al2O3 on electrical and thermal conductivities and thermal expansion behaviors, the Cu-Ni matrix was supplemented with 3, 5, and 8 wt% Al2O3 . The findings revealed that Al2O3 nanoparticles (20 nm) were dispersed uniformly throughout the copper-nickel matrix. Microhardness was improved from 53.3 HV for Cu-Ni matrix to 92.7 HV for Cu-Ni/8%Al2O3 nanocomposites. The electrical and thermal conductivities and thermal expansion coefficient were reduced as the amount of Al2O3 in the Cu-Ni matrix increased. The electrical conductivity was reduced by 38.7% by addition 5% Al2O3 nanoparticles to Cu-Ni matrix. The high interfacial bonding between Cu-Ni and Al2O3 nanoparticles was the main reason of the hardness improvement and maintaining relatively good electrical and thermal properties.