Low-loss optical interposer with recessed vertical-cavity surface-emitting laser diode and photodiode chips into Si substrate

被引：4

作者：

Fujiwara, Makoto ^{[1
,2
]}

Terada, Shinsuke ^{[1
]}

Shirato, Yoji ^{[1
]}

Owari, Hiroshi ^{[1
]}

Watanabe, Kei ^{[1
]}

Matsuyama, Mutsuhiro ^{[1
]}

Takahama, Keizo ^{[1
]}

Mori, Tetsuya ^{[1
]}

Miyao, Kenji ^{[1
]}

Choki, Koji ^{[1
]}

Fukushima, Takafumi ^{[2
]}

Tanaka, Tetsu ^{[2
]}

Koyanagi, Mitsumasa ^{[2
]}

机构：

[1] Sumitomo Bakelite Co Ltd, Totsuka Ku, Yokohama, Kanagawa 2450052, Japan

[2] Tohoku Univ, Grad Sch Engn, Dept Bioengn & Robot, Sendai, Miyagi 9808579, Japan

来源：

JAPANESE JOURNAL OF APPLIED PHYSICS | 2008年 / 47卷 / 04期

关键词：

optical interconnection; optical interposer; passive alignment; polynorbornene (PNB); optical waveguide;

D O I：

10.1143/JJAP.47.2936

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

A new interposer with an optical interconnection called optical interposer has been proposed for a high-performance parallel processor system. The optical interposer is composed of polynorbornene (PNB) optical waveguides with 45 degrees micromirrors and a Si substrate having chip-sized through-Si holes of 150 pm depth. The polymeric waveguides are formed on the Si substrate before forming the through-Si holes by deep reactive ion etching (DRIE). Vertical-cavity surface-emitting laser diode (VCSEL) and photodiode (PD) chips are placed onto the photolithographically defined hole patterns that are 15 mu m larger than the size of the chips. In addition, the chips can be precisely aligned and recessed into the holes by passive alignment of selfassembly driven by the surface tension of a lead-free solder. We can fabricate the low-loss optical interposer with an insertion loss of below 0.2dB measured at the waveguide length of 5cm and a coupling loss of 0.5dB measured with a 45 degrees micromirror.

引用

页码：2936 / 2940

页数：5

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