Model-based verification for first time right manufacturing

被引:10
作者
Bruce, JA [1 ]
Conrad, EW [1 ]
Dick, GJ [1 ]
Nickel, DJ [1 ]
Smolinski, JG [1 ]
机构
[1] IBM Corp, Syst & Technol Div, Essex Jct, VT 05452 USA
来源
Design and Process Integration for Microelectronic Manufacturing III | 2005年 / 5756卷
关键词
OPC; optical proximity correction; verification; simulation;
D O I
10.1117/12.600552
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this paper we will describe the implementation of a system for model-based verification of post OPC data into a manufacturing data flow. Verification is run automatically, upon OPC completion, on the critical levels for every chip run in the 130nm node and beyond to ensure that OPC errors are caught before hardware is committed in the manufacturing line. The checks are derived from the design rule manual, and are written to cover the intent of the design rules. Some of the challenges of implementing a robust model-based verification solution for manufacturing will be discussed, including resource requirements, data management, cycle time, and the creation of a closed loop system to ensure that verification is completed on all chips. The benefits of implementing model-based verification include improved feedback to lithography and OPC teams, enabling constant improvement, as well as increasing the probability of first time right manufacturing of a new chip design.
引用
收藏
页码:198 / 207
页数:10
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