24-Element Antenna-in-Package for Stationary 60-GHz Communication Scenarios

被引：50

作者：

Hong, Wonbin ^{[1
]}

Goudelev, Alexander ^{[1
]}

Baek, Kwang-hyun ^{[1
]}

Arkhipenkov, Vladimir ^{[1
]}

Lee, Juhyung ^{[1
]}

机构：

[1] Samsung Elect, Digital Media & Commun Res Ctr, Suwon 443742, South Korea

来源：

IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS | 2011年 / 10卷

关键词：

Analog beamforming; antenna-in-package (AiP); low-temperature co-fired ceramics (LTCC); millimeter-wave; patch antenna; CMOS; LTCC;

D O I：

10.1109/LAWP.2011.2162640

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An integrated multilayer antenna-in-package (AiP) targeted for stationary 60-GHz communication is presented. The key differences in design conditions for mass-market-level and prototype-level AiP are discussed and reflected during the design process. Hence, a low-cost and high-reliability package solution is realized. The proposed AiP consists of a 4 x 6 array of 24 stacked circular patch antennas and corresponding antenna feed lines designed for phased array. The finalized LTCC AiP prototype features 20 x 15 x 1.02 mm(3) in dimension. Solder bump flip-chip technology is used to attach the AiP to the RFIC for system-level assembly. The assembled package is evaluated using a custom-designed near-field measurement setup. EM simulations and measurements confirm the presented AiP features more than 9 GHz bandwidth, 45 degrees beam-steering ranges in both E- and H-planes, and more than 14.5 dBi gain at boresight.

引用

页码：738 / 741

页数：4

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