Interfacial reaction and mechanical properties of eutectic Sn-0.7Cu/Ni BGA solder joints during isothermal long-term aging

被引：103

作者：

Yoon, JW ^{[1
]}

Kim, SW ^{[1
]}

Jung, SB ^{[1
]}

机构：

[1] Sungkyunkwan Univ, Dept Adv Mat Engn, Suwon 440746, South Korea

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2005年 / 391卷 / 1-2期

关键词：

Sn-0.7Cu solder; ball-grid-array (BGA); interfacial reaction; intermetallic compound (IMC); ball-shear test;

D O I：

10.1016/j.jallcom.2004.09.001

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The interfacial reactions and growth kinetics of intermetallic compound (IMC) layers formed between Sn-0.7Cu (wt.%) solder and Au/Ni/Cu substrate were investigated at aging temperatures between 70 and 170 degrees C for up to 100 days. After reflow, the IMC formed at the interface was (Cu,Ni)(6)Sn-5. In addition, only this (Cu,Ni)(6)Sn-5 layer was observed in the samples aged at temperatures between 70 and 150 degrees C. On the other band, after isothermal aging at 170 degrees C for 50 days, the solder/Ni interface exhibited a duplex structure of (Cu,Ni)(6)Sn-5 and (Ni,Cu)(3)Sn-4. The time exponents (n) determined at temperatures below 150 degrees C were about 0.2. The determined n values are presumably related to a grain boundary diffusion-controlled mechanism. In the ball-shear tests, the shear strength significantly decreased after aging for initial 1 day, after which it remained nearly unchanged through further prolonged aging. In all samples, fracture occurred in the bulk solder. (c) 2004 Elsevier B.V. All rights reserved.

引用

页码：82 / 89

页数：8

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