Molecular dynamics simulation of nano-scale interfacial friction characteristic for different tribopair systems

被引:24
作者
Lin, En-Qiang [1 ]
Niu, Li-Sha [1 ]
Shi, Hui-Ji [1 ]
Duan, Zheng [1 ]
机构
[1] Tsinghua Univ, Dept Engn Mech, Sch Aerosp, AML, Beijing 100084, Peoples R China
关键词
Molecular dynamics; Sliding friction; Embedded atom potential; Microstructural changes; Thermal effect; DUCTILE MATERIALS; CRYSTALLINE MATERIALS; SLIDING WEAR; CU; EVOLUTION; METALS; COPPER; MODEL; NI;
D O I
10.1016/j.apsusc.2011.04.117
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
3D non-equilibrium molecular dynamics (NEMD) simulations using embedded atom potentials method (EAM) are performed to identify the dynamics processes of atomic-scale interfacial friction taking places in metal tribopairs. A block-block sliding simulation model for soft-to-hard (Cu/Fe) and soft-to-soft (Cu/Ag) tribopairs with is built. The microstructural evolution and temperature variation of the two tribopairs are analyzed at different sliding speeds. The results show that the average temperature of the two different tribopairs both increases rapidly during the transient sliding period. The different microstructural changes for the two tribopairs, including extensive plastic deformation, mechanical mixing and material transfer are observed when the temperature rapidly increases. The characteristics of the friction effects for the two tribopairs are also revealed by analyzing the friction force evolution as a function of time and velocity. (C) 2011 Elsevier B.V. All rights reserved.
引用
收藏
页码:2022 / 2028
页数:7
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