Pull force and tail breaking force optimization of the crescent bonding process with insulated Au wire

被引：6

作者：

Lee, J. ^{[1
]}

Mayer, M. ^{[1
]}

Zhou, Y. ^{[1
]}

Persic, J. ^{[2
]}

机构：

[1] Microjoining Lab, Ctr Adv Mat Joining, Dept Mech & Mechatron Engn, Markham, ON, Canada

[2] Microbonds Inc, Markham, ON, Canada

来源：

2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2 | 2007年

基金：

加拿大自然科学与工程研究理事会;

关键词：

D O I：

10.1109/EPTC.2007.4469818

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Strong crescent bond and strong tail bond are crucial for maintaining reliability and bondability of the wire bond and stability of the bonding process, respectively. This study investigates the optimization of tail breaking force and pull force of the crescent bond with insulated X-Wire(TM). The pull force and the tail breaking force are individually optimized by an iteration method. The results are compared with the results of bare Au wire. Ultrasonic power which is a measure of ultrasonic amplitude, combined with a cleaning stage during bonding plays a significant role in initiating the removal of the insulated layer of X-Wire(TM) during the crescent bonding process. The pull force and the tail breaking force of insulated X-Wire(TM) are 91.4+/-11.78 mN and 59.15+/-5.35 mN, comparable to those of bare Au wire.

引用

页码：725 / +

页数：2

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