Topology optimization on two-dimensional manifolds

被引:10
作者
Deng, Yongbo [1 ,2 ]
Liu, Zhenyu [3 ]
Korvink, Jan G. [1 ]
机构
[1] Karlsruhe Inst Technol, Inst Microstruct Technol, Hermann von Helmholtzpl 1, D-76344 Eggenstein Leopoldshafen, Germany
[2] Chinese Acad Sci, Changchun Inst Opt Fine Mech & Phys CIOMP, SKLAO, Dongnanhu Rd 3888, Changchun 130033, Peoples R China
[3] Chinese Acad Sci, Changchun Inst Opt Fine Mech & Phys CIOMP, Dongnanhu Rd 3888, Changchun 130033, Peoples R China
基金
中国国家自然科学基金;
关键词
Topology optimization; Two-dimensional manifold (2-manifold); Material distribution method; Tangential gradient operator; Mixed boundary condition; LEVEL SET METHOD; STRUCTURAL OPTIMIZATION; EVOLUTIONARY TOPOLOGY; COMPLIANT MECHANISMS; DESIGN; SHAPE; STIFFNESS;
D O I
10.1016/j.cma.2020.112937
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper presents topology optimization on general two-dimensional manifolds for phenomena described by second-order partial differential equations, where the material interpolation is implemented by using the material distribution method. When a physical field is defined on a two-dimensional manifold, the material interpolation is implemented on a material parameter in the partial differential equation used to describe the distribution of the physical field. When the physical field is defined on a three-dimensional domain with its boundary conditions defined on a two-dimensional manifold corresponding a surface or an interface of this three-dimensional domain, the material density is used to formulate a mixed boundary condition of the partial differential equation for the physical field and implement the penalization between two different boundary types. Based on the homeomorphic property of two-dimensional manifolds, typical two-dimensional manifolds, e.g., sphere, torus, Mobius strip and Klein bottle, are included in the numerical tests, which are used to demonstrate this topology optimization approach for the design problems of fluidic mechanics, heat transfer and electromagnetics. (C) 2020 Elsevier B.V. All rights reserved.
引用
收藏
页数:24
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