Robust self-assembly of interconnects by parallel DNA growth

被引:0
|
作者
Hashempour, Masoud [1 ]
Arani, Zahra Mashreghian [1 ]
Lombardi, Fabrizio [1 ]
机构
[1] Northeastern Univ, Dept ECE, Boston, MA 02115 USA
来源
2007 IEEE INTERNATIONAL SYMPOSIUM ON NANOSCALE ARCHITECTURE | 2007年
关键词
parallel growth; error tolerance; interconnect; self-assembly; puncture;
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Self-assembly has been employed in nano-technology to build crystals using individual components (commonly referred to as tiles) with limited control. Templates of regular lattice structures for two-dimensional scaffolds and interconnects have been implemented by self-assembly. This paper proposes a diagonally-based growth scheme that is applicable to these templates. Differently from previous techniques (mostly sequential in execution), growth is allowed along two different directions in the aggregate, thus permitting a parallel mode of operation. This is made possible by initially utilizing a tile set and binding scheme to allow multiple seed tiles to grow along the main diagonal of the pattern. The conditions by which this type of new growth is possible at a reduced error occurrence in mismatched tiles, are presented; error tolerance is achieved by employing robust generation of the seed and diagonal tiles. Simulation results are presented using Xgrow [10].
引用
收藏
页码:70 / 76
页数:7
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