Ion beam etching of PZT thin films:: Influence of grain size on the damages induced

被引:5
作者
Soyer, C [1 ]
Cattan, E [1 ]
Rèmiens, D [1 ]
机构
[1] IEMN, UMR 8520, CNRS, DOAE, F-59655 Villeneuve Dascq, France
关键词
PZT; films; electrical properties; grain size; etching damage;
D O I
10.1016/j.jeurceramsoc.2005.03.043
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Ion beam etching (IBE) of sputtered Pb(Zr-0.54,Ti-0.46)O-3 has been performed using pure Ar gas. We have studied the damages induced by the etching process on the microstructural and electrical properties. In a previous study, we had demonstrated the influence of etching parameters on the extent of the degradations. We evaluate now the influence of the microstructure (grain size) of the PZT thin film. Indeed, we can obtain sputtered PZT thin films with small (< 1.5 mu m) and large (>> 1.5 mu m) grain size. In the first part, we compare the properties of these two types of PZT thin films before etching. In the second part, we compare the results obtained after etching. The properties (particularly the roughness and the ferroelectric properties) of PZT films with large grain size appear to be more damaged after IBE. (c) 2005 Elsevier Ltd. All rights reserved.
引用
收藏
页码:2269 / 2272
页数:4
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